JAMES HARPER 
Professor, Physics Department, Materials Science Program
(603) 862-1962
E-mail: james.harper@unh.edu
Expertise:
Materials science of thin films and electronic materials , Condensed matter physics, Silicon chip interconnections and contacts, Ion beam modification of materials and surfaces, Low temperature physics, Industrial research and development
Professional Interests:
Thin film materials science. Synthesis of multicomponent thin films using a combination of plasma deposition and low energy ion bombardment. Modification of composition, morphology and microstructure to optimize the properties for specific applications, including electronic materials, hard coatings and interactions of molecules with surfaces.
Education:
1975 |
Ph.D. in Applied Physics, Stanford University, Stanford, California |
1968 |
B.A. in Physics, Harvard University, Cambridge, Massachusetts Cum Laude |
Publications:
2002 |
Picosecond Ultrasonic Study of the Vibrational Modes of a Nanostructure |
2002 |
Effects of Alloying Elements on Cobalt Silicide Formation |
2001 |
In situ Resistivity Study of Copper-Cobalt Films: Precipitation, Dissolution and Phase Transformation |
2000 |
Mechanisms for Enhanced Formation of the C54 Phase of Titanium Silicide Ultra-Large-Scale Integration Contacts |
2000 |
Detection of Cobalt Silicide Phase Formations by Ultrafast Optical Measurements |
1999 |
Optimization of Ta-Si-N Thin Films for Use as Oxidation-Resistant Diffusion Barriers |
1999 |
Mechanisms for Microstructure Evolution in Electroplated Copper Thin Films Near Room Temperature |
1998 |
Interdiffusion and Phase Formation in Cu(Sn) Alloy Thin Films |
1998 |
Copper Interconnections and Reliability |
1997 |
Microstructure Control in Semiconductor Metallization |
1997 |
Crystallographic Texture of C54 Titanium Disilicide as a Function of Deep Submicron Structure Geometry |
1997 |
Control of In-Plane Texture of Body Centered Cubic Metal Thin Films |
1997 |
Low Temperature Formation of C54-TiSi2 Using Titanium Alloys |